High-converting efficiency large-mechanical strength thermoelectric module
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United States of America Patent
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Sep 3, 2002
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N/A
app pub date -
Jun 13, 2000
filing date -
Jun 15, 1999
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Abstract
A thermoelectric module includes n-type semiconductor columns and p-type semiconductor columns connected in series through metal electrodes formed on inner surfaces of a pair of electrically insulating substrates, and the semiconductor columns are arranged so dense that the total cross sections of the semiconductor columns occupy at least 42 percent of one of the inner surfaces, whereby the converting efficiency is improved by virtue of restriction of the convective heat transfer between the electrically insulating substrates.
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