Coated semiconductor die/leadframe assembly and method for coating the assembly
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United States of America Patent
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Sep 3, 2002
Issued Date -
N/A
app pub date -
Aug 22, 2000
filing date -
Sep 26, 1995
priority date (Note) -
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Abstract
A novel method for coating a semiconductor die/leadframe assembly prior to ocncapsulation. The method of the invention comprises coating the exposed surfaces of the die and the inner lead fingers in a die/leadframe assembly with an adhesion promoting material, typically a polyimide. A solution of the adhesion promoting material is dispensed from a spray nozzle to coat the die and the inner lead fingers, Preferably all exposed surfaces of the die, the inner lead fingers and the bond wires are coated prior to encapsulation. The invention also provides an improved semiconductor package that includes a semiconductor dielleadframe assembly and a layer of adhesion promoting material coating the exposed surfaces of the die and the inner lead fingers. The die/leadframe assembly is encapsulated in a molded plastic package.
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