Importance

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Abstract

A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a PCB board. One or more multi-conductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry. One embodiment of the multi-conductor insulating assembly includes tape (such as Kapton.TM. tape) on which conductors are applied. One surface of the tape is preferably adhesive so as to stick to the integrated circuit devices. When properly aligned, the conductors make contact with the terminals of the integrated circuit devices and with a multi-conductor port. There may be multiple layers of conductors where different terminals aligned in a stack are to receive different signals. Another embodiment of the multi-conductor insulating assembly includes an epoxy onto which conductors are applied. In yet another embodiment, multi-conductor insulating assembly tape is sandwiched between integrated circuit semiconductor devices. Contact pads on the tape are aligned with bond pads on the integrated circuit semiconductor devices.

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First Claim