Electronic assembly
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United States of America Patent
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-
Sep 3, 2002
Issued Date -
N/A
app pub date -
Sep 3, 1996
filing date -
Aug 30, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Assemblies for electronic components, in particular for automotive electronics, must satisfy increasingly stringent demands in terms of quality and especially cost efficiency. These demands are met by the assembly in accordance with the present invention, wherein the electronic components are arranged on a printed circuit board which in turn is firmly and directly connected to the surface of the metal plate. The printed circuit board and the components are molded using a suitable plastic material in such a way that the molding creates a positive connection with the metal plate at the periphery of the printed circuit board, and thus forms a moisture-proof housing both for the printed circuit board and for the components. Further advantages are in the considerable savings in material and also in a reduced production depth in comparison with known assemblies, resulting in the required cost efficiency.
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