Importance

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Abstract

An automated door assembly is provided for sealing an opening in a barrier to a contaminant-free environment suitable for semiconductor wafer processing. The door assembly comprises a base pivotable toward and away from the opening along an arcuate path and a closure plate linearly movably coupled to the base and configured to a seal the opening in the barrier. The closure plate is removable in synchronization with the pivoting of the base to traverse a horizontal linear path into contact with the barrier to close the opening. A vacuum system is provided in conjunction with the door assembly to extract particles from the sealed environment. A sensor disposed on the closure plate is operable to sense the position of wafers or other objects disposed adjacent the opening, to detect misalignment or omission thereof. The closure plate can be provided in a number of sizes for interchangeability to accommodate different sized pods; similarly, bezel inserts having different sized openings therein can be provided in the barrier. A latching apparatus for latching a wafer pod or cassette is also provided. The latching apparatus includes a pod support and a platform linearly movably coupled to the pod support. A locking mechanism configured to mate with a corresponding mechanism on the pod is rotatably mounted to the pod support and coupled to the platform for linear motion therewith, such that linear motion of the platform is operative to rotate the locking mechanism into locking engagement with the pod. The platform includes three beveled pins matable with corresponding openings having beveled surfaces on the pod.

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First Claim