Socket for coupling an integrated circuit package to a printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 10, 2002
Issued Date -
N/A
app pub date -
Nov 18, 1999
filing date -
Jul 21, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit to a printed circuit board. The integrated circuit package includes a base having a bottom and a side. A flex circuit having traces therein is coupled to the base. The traces in the flex circuit are designed to couple to the leads of the integrated circuit. The traces further are designed to couple to traces on the printed circuit board.
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