Security thread and method and apparatus for applying same to a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 10, 2002
Grant Date -
N/A
app pub date -
Nov 15, 1999
filing date -
Nov 20, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Applied to a substrate such as paper banknotes is a thread which includes a PET carrier layer with release layers on both surfaces of the carrier layer, and a metallic layer outward of one release layer. An adhesive layer lies outward of the metallic layer. When a substrate is brought into contact with the adhesive layer, the result is to bond the metallic layer to the substrate. Following this, the PET carrier layer is peeled away, leaving the metallic layer bonded to the substrate. An apparatus for accomplishing these steps includes means for bringing the substrate into contact with the adhesive layer, and means for peeling the PET carrier layer away so that it separates from the metallic layer at the adjacent release layer.
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