Thin copper on usable carrier and method of forming same
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United States of America Patent
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Sep 10, 2002
Issued Date -
N/A
app pub date -
Aug 29, 2000
filing date -
Aug 29, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 .mu.m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 .mu.m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.
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