Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
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United States of America Patent
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Sep 10, 2002
Grant Date -
N/A
app pub date -
Oct 2, 2000
filing date -
Oct 2, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a semiconductor chip assembly includes providing a semiconductor chip and a conductive metal, wherein the chip includes a conductive pad, the conductive metal includes a dimple, and the pad is aligned with the dimple, etching the conductive metal on a side opposite the dimple such that the dimple forms a through-hole in the conductive metal, and forming a connection joint in the through-hole that electrically connects the conductive metal and the pad. The method may include mechanically attaching the chip to the conductive metal using an adhesive before forming the through-hole, and forming an opening in the adhesive directly beneath the through-hole thereby exposing the pad after mechanically attaching the chip to the conductive metal and before forming the connection joint.
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