Hot melt adhesives for dermal application
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United States of America Patent
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-
Sep 10, 2002
Grant Date -
Sep 12, 2002
app pub date -
Dec 29, 2000
filing date -
Dec 29, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A pressure sensitive hot melt adhesive composition which comprises a high molecular weight rubber and less than about 60 parts by weight of a liquid diluent, and has a G' of less than about 15.times.10.sup.4 dynes/cm.sup.2 at 10 rad/s at 25.degree. C. is useful for adhesive skin application (e.g., surgical tape), including transdermal drug delivery applications.
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