Importance

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Abstract

A flip chip assembly, and methods of forming the same, including a single layer or multilayer substrate in which via holes serve as connections between a semiconductor chip and the substrate. The assembling steps comprise attaching an integrated circuit chip to a rigid or flexible dielectric substrate having a plurality of via holes for connecting respective traces on the substrate with respective input/output terminal pads of the integrated circuit chip. The via holes are aligned and placed on top of the pads so that the pads are totally or partially exposed through the opposite side of the substrate. Electrically conductive material is subsequently deposited in the via holes as well as on the surface of the pads to provide electrical connections between the integrated circuit chip and the traces of the dielectric circuitry. After the connections are made, the attachment between the chip and substrate can be removed or left as an integral part of the assembly since the connections also provide mechanical support. The contacting materials include electroless plated metals, electrochemical plated metals, solders, epoxies and conductive polymers.

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First Claim