Semiconductor module with imbedded heat spreader
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United States of America Patent
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Sep 10, 2002
Grant Date -
N/A
app pub date -
May 3, 2000
filing date -
May 3, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partially attached to the heat spreader, where at least one of the electrically conductive leads is preferably common to both of the semiconductors. The two semiconductors may be mounted or preferably directly bonded onto opposing side walls of the heat spreader. The invention also provides a method of making the abovementioned semiconductor module.
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