Apparatus for exposing a substrate to plasma radicals
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United States of America Patent
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Sep 17, 2002
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app pub date -
Nov 12, 1999
filing date -
Apr 22, 1999
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Abstract
An apparatus and method for exposing a substrate to plasma including a first reaction chamber adapted to generate a plasma comprising ions and radicals and a second reaction chamber coupled to the first reaction chamber and adapted to house a substrate at a sight in the second reaction chamber. The second reaction chamber is coupled to the first reaction chamber by an inlet member and radicals of the plasma flow through the inlet member into the second reaction chamber.
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