Heat treatment apparatus
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United States of America Patent
Stats
-
Sep 17, 2002
Grant Date -
Aug 9, 2001
app pub date -
Feb 13, 2001
filing date -
Jan 12, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective portions on the heat treatment table and temperatures detected by the sensors is grasped in advance, thereby enables to surmise a temperature of the respective portion of the heat treatment table from the temperature detected by the sensors. In the case of an wafer being actually treated by placing on the heat treatment table, the temperatures detected by the sensors are observed, from these detected temperatures, the temperatures of the respective portions on the heat treatment table, that is, temperatures affecting the wafer, are surmised.
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