Hot plate cooling method and heat processing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 17, 2002
Grant Date -
N/A
app pub date -
Aug 9, 2000
filing date -
Aug 11, 1999
priority date (Note) -
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Abstract
In a heat processing apparatus for heating a wafer on a hot plate, a black plate having at least a rear face practically having a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles onto the rear face of the hot plate so that the temperature of the hot plate can be cooled rapidly.
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