Method of manufacturing an intracutaneous microneedle array

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United States of America Patent

PATENT NO 6451240
SERIAL NO

09579798

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A microneedle array is manufactured using a mold preparation procedure that begins by placing an optical mask over a layer of PMMA material, exposing the PMMA material to x-rays, then developing using a photoresist process. The remaining PMMA material is then electroplated with metal. Once the metal has reached an appropriate thickness, it is detached to become a metal mold that is used in a microembossing procedure, in which the metal mold is pressed against a heated layer of plastic material. Once the mold is pressed down to its proper distance, the plastic material is cooled until solidified, and the mold is then detached, thereby leaving behind an array of microneedles.

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Patent Owner(s)

  • CORIUM INTERNATIONAL, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gartstein, Vladimir Cincinnati, OH 81 6128
Owens, Grover David Fairfield, OH 22 4360
Sherman, Faiz Feisal West Chester, OH 162 6612
Yuzhakov, Vadim Vladimirovich Cincinnati, OH 10 2988

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