Substrate treating method
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United States of America Patent
Stats
-
Sep 17, 2002
Grant Date -
Dec 6, 2001
app pub date -
Aug 4, 1999
filing date -
Aug 5, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.
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