Electrostatic chuck and method for manufacturing the same
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United States of America Patent
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Sep 17, 2002
Grant Date -
N/A
app pub date -
Jun 30, 2000
filing date -
Mar 31, 2000
priority date (Note) -
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Abstract
An electrostatic chuck includes a metal substrate. A conductive ceramic layer is disposed above the metal substrate. A high purity barrier layer is disposed above the conductive ceramic layer. The high purity barrier layer preferably has a thickness of not more than about 200 .mu.m and a purity of at least about 99%. Exemplary materials from which the high purity insulation layer may be formed include alumina, silicon dioxide, silicon nitride, and sapphire. A method for manufacturing an electrostatic chuck includes providing a metal substrate, forming a ceramic layer over the metal substrate, and forming a high purity barrier layer over the ceramic layer. The high purity barrier layer may be formed by plasma spray coating, chemical vapor deposition, or sputtering.
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