Method and apparatus for up to full width ultrasonic bonding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6454890
SERIAL NO

09727218

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Abstract

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Bonding apparatus and methods for creating up to full-width ultrasonic bonds in an advancing web. The bonding apparatus comprises a first nip, defined by, in combination, a first set of bonding elements comprising a first rotary ultrasonic horn and a first rotary anvil, and first engagement apparatus bringing the first horn and first anvil into effective bonding engagement with each other. The first horn and anvil being supported from support structure and rotating in common with each other thereby to convey the web through the first nip. The bonding apparatus also comprises a second nip, defined by a second set of bonding elements comprising second separate and distinct horn and anvil, and second engagement apparatus bringing the second horn and second anvil into effective bonding engagement with each other. The first and second sets of bonding elements are cooperatively disposed at first and second separate and distinct work stations spaced along the length of the operations path, and are preferably disposed at respective first and second different locations across the width of the operations path.

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Patent Owner(s)

Patent OwnerAddress
DUKANE IAS LLC2900 DUKANE DRIVE ST CHARLES IL 60174

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abel, Kent William Black Creek, WI 4 54
Couillard, Jack Lee Menasha, WI 17 467
Nason, Robin Kurt Oshkosh, WI 6 192

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