Structuring method
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United States of America Patent
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Sep 24, 2002
Grant Date -
N/A
app pub date -
Aug 3, 1998
filing date -
Aug 1, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A method for structuring at least one layer to be structured. First, a mask is applied to the layer and the layer is structured using the mask. After the structuring step, the mask is then removed, while leaving behind redepositions of the material of the layer. The redepositions of the material of the layer are removed by mechanical polishing or chemical-mechanical polishing.
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