Thermoplastic resin composition

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United States of America Patent

PATENT NO 6455636
APP PUB NO 20010011118A1
SERIAL NO

09759256

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Abstract

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There is disclosed a thermoplastic resin composition comprising; (i) 30 to 94% by weight of a polypropylene (A), (ii) 5 to 69% by weight of a polyphenylene ether (B), and (iii) 1 to 50% by weight of a copolymer (C), provided that a total weight of the components (A), (B) and (C) is 100% by weight, wherein the copolymer (C) has a molar ratio of a structural unit derived from the .alpha.-olefin represented by the following formula (I) to a structural unit derived from ethylene of not less than (0.8/(3n+2)/1, CH.sub.2 =CH--(CH.sub.2).sub.n CH.sub.2 CH.sub.3 (I) wherein n is an integer of 0 to 10.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO CHEMICAL COMPANY LIMITED2-7-1 NIHONBASHI CHUO-KU TOKYO 1036020 ?1036020

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sanada, Takashi Ichihara, JP 94 1106

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