Micromirror device package
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United States of America Patent
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-
Sep 24, 2002
Grant Date -
N/A
app pub date -
Mar 12, 2001
filing date -
Mar 12, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A micromirror device package includes a micromirror device chip having a micromirror device area on an upper surface of the micromirror device chip. A window is mounted above the micromirror device area and to the upper surface of the micromirror device chip by a bead. By forming the window of borosilicate glass and the bead of solder glass, the micromirror device area is hermetically sealed. In this manner, corrosion and contamination of the micromirror device area is prevented.
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