Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
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United States of America Patent
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Sep 24, 2002
Grant Date -
N/A
app pub date -
Sep 18, 2000
filing date -
Dec 13, 1999
priority date (Note) -
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Abstract
Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
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