Thermoplastic resin composition

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United States of America Patent

PATENT NO 6458893
APP PUB NO 20020028882A1
SERIAL NO

09904977

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Abstract

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A thermoplastic resin composition comprising 40 to 95 parts by weight of (a) a saponified ethylene-vinyl acetate copolymer resin and 60 to 5 parts by weight of (b) at least one selected from the group consisting of copolymers of a vinyl aromatic compound with a conjugated diene compound, and hydrogenated derivatives thereof, characterized in that the saponified ethylene-vinyl acetate copolymer resin (a) has an ethylene content of 40 to 95 wt % based on a weight of the saponified ethylene-vinyl acetate copolymer resin and a degree of saponification of the vinyl acetate of at least 80 wt % and (b)at least one selected from the group consisting of copolymers of a vinyl aromatic compound with a conjugated diene compound is selected from the group consisting of (b-1) block copolymers of a vinyl aromatic compound with a conjugated diene compound, and hydrogenated derivatives thereof and (b-2) hydrogenated random copolymers of a vinyl aromatic compound with a conjugated diene compound, the copolymers having a vinyl aromatic compound content of at most 50 wt %, a number average molecular weight(Mn) of from 5,000 to 1,000,000, a polydispersity(Mw/Mn) of at most 10, and a content of vinyl bonds derived from the conjugated diene compound of at least 10% based on bonds derived from the conjugated diene compound.

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Patent Owner(s)

Patent OwnerAddress
RIKEN TECHNOS CORPORATION101 KANDA-AWAJICHO 2-CHOME CHIYODA-KU TOKYO 1018336 ?1018336

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tasaka, Michihisa Tokyo, JP 24 172
Yamanaka, Toshimi Tokyo, JP 6 43

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