Semiconductor device and double-sided multi-chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 1, 2002
Grant Date -
N/A
app pub date -
Jan 20, 2000
filing date -
Jan 22, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device has a circuit board, a main chip mounted on a first surface of the circuit board, a subchip mounted on a second surface of the circuit board, interface circuits distributed in the main chip along four sides of the main chip, respectively, to interface the main chip and the subchip with each other, subchip connecting terminals for connecting the interface circuits and the subchip to each other through the circuit board, main-chip connecting terminals for connecting the main chip and the outside to each other, subchip bonding terminals connected to the subchip, a first wiring area for connecting the subchip bonding terminals and the subchip connecting terminals to each other, package terminals for connecting the main chip and the outside to each other, and a second wiring area for connecting the package terminals and the main-chip connecting terminals to each other.
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