Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
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United States of America Patent
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Oct 8, 2002
Grant Date -
Feb 21, 2002
app pub date -
Sep 13, 1999
filing date -
Sep 13, 1999
priority date (Note) -
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Abstract
According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.
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