Semiconductor card and method of fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Oct 8, 2002
Grant Date -
Sep 19, 2002
app pub date -
Mar 16, 2001
filing date -
Mar 16, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor card includes a printed circuit substrate and one or more semiconductor components, such as dice or packages, mounted to the substrate. The substrate is initially a segment of a strip containing several substrates. The substrate is defined by a peripheral opening in the strip, and is connected to the strip by connecting segments. The card also includes a plastic body molded to the substrate and having notches that initially align with the connecting segments. The notches provide access for severing the connecting segments, and also enclose any slivers of substrate material resulting from severing of the connecting segments. A method for fabricating the package includes the steps of providing the strip, and providing a molding apparatus configured to mold the plastic body to the substrate. The molding apparatus includes pins configured to contact the connecting segments to form the notches. A system for performing the method includes the strip, the molding apparatus and a punch apparatus for severing the connecting segments.
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