System and method for material processing using multiple laser beams

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United States of America Patent

PATENT NO 6462306
SERIAL NO

09558368

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A material machining system for machining a workpiece (PCB, PWB etc.) for drilling blind vias. The system includes a laser supply system (20, 26, 30) for supplying discrete machining beams (22a, 22b) that are separate from each other. A deflecting devices (28, 32) is provided for deflecting each of the discrete machining beams to generate multiple independent beams at a plurality of positions within a field of operation on the workpiece. A scan lens (34) having an entrance pupil configured to receive the multiple independent beams from the deflecting devices is provided proximate to the entrance pupil of the scan lens. A computer is used for controlling the deflecting devices to change the respective positions of the multiple independent beams in at least one co-ordinate direction within the field of operation. The deflecting devices include galvo/mirror pairs at the entrance pupil of the scan lens. This is accomplished since the scan lens has a relatively large entrance pupil and the mirror parts are small. The advantage of this arrangement is the ability of all beams to access a full working field (typically 2.times.2 inches) on the workpiece simultaneously, so that the highest efficiency of laser power utilization is achieved.

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Patent Owner(s)

  • ELECTRO SCIENTIFIC INDUSTRIES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitai, Anton Theodore Ottawa, CA 3 122
Miller, Ian James Gloucester, CA 13 357
Moffat, Steven Harold Carleton Place, CA 8 85

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