Semiconductor wafer having a bank on a scribe line
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 8, 2002
Grant Date -
Nov 1, 2001
app pub date -
Mar 26, 2001
filing date -
Mar 27, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor wafer includes a plurality of chips arranged in a matrix and a plurality of scribe lines separating the chips from one another. A polyimide overcoat film covering each chip except for electrode pads of the chip has a bank crossing the scribe line for preventing the ground particles generated by grinding the bottom surface of the wafer from entering the chip along the scribe lines.
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