Importance

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Abstract

A laminate-type semiconductor apparatus utilizing a flexible substrate being mounted with a plurality of semiconductor devices, in which the laminate-type semiconductor apparatus is free from incurring heat-radiation problem and has a fully leveled connection parts with sufficiently durable strength whereby distinctively compatible with high-density mounting thereof. More particularly, the present invention provides a laminate-type semiconductor apparatus which comprises a foldable flexible substrate mounted with a plurality of laminated semiconductor devices thereon, in which the foldable flexible substrate is folded so that plurality of semiconductor-device mounting areas of the substrate are mutually superposed whereby forming a laminate structure of semiconductor-device mounting areas thereon. An externally connected terminal disposing area disposed with a plurality of externally connected terminals is formed on one surface thereof. In addition, a reinforcing plate is secured to the side of the externally connected terminal disposing area via a material portion (adhesive agent) having stress relaxing function. Further, a heat-radiating plate is secured onto a surface on the opposite side from the externally connected terminal disposing area.

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First Claim