Substrate processing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 15, 2002
Grant Date -
N/A
app pub date -
Jun 8, 2000
filing date -
Jun 11, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A cooling processing unit for cooling a wafer to a predetermined temperature is disposed between a heat processing unit and a set of a resist coating processing unit and a developing processing unit. Pre-cooling units are stacked in multi-stages on top of the cooling processing unit. Immediately after having undergone heat processing in the heat processing unit, the wafer is first transferred to the pre-cooling unit by a first transfer machine. Thereafter, the wafer is transferred to the cooling processing unit by a third transfer machine to be cooled to the predetermined temperature, and then transferred to the resist coating processing unit by a second transfer machine. Thus, over-bake of the wafer can be prevented.
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