Importance

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Abstract

An irregularly etched metallic medical implant device is provided having random non-uniform relief patterns on the surface ranging from about 0.3 .mu.m to less than about 20 .mu.m in depth. The random, irregular surface as defined by the etch micromorphology and respective dimensional properties is sobtained by exposing a surface to a reactive plasma in a chamber wherein said reactive plasma produces a reaction product with the surface to thereby etch the surface, said reaction product or a complex thereof having a vapor pressure lower than a pressure in the chamber; providing a dynamic masking agent during the etching process; and removing the reaction products.

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First Claim