Binder system for moulding mixtures for the production of moulds and cores
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United States of America Patent
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Oct 15, 2002
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N/A
app pub date -
Jun 1, 2000
filing date -
Jun 1, 1999
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Abstract
Two-component binder system with reduced release of aromatic compounds during foundry operations, the system consisting of a phenol resin component and a polyisocyanate component, the phenol resin component comprising a phenol resin having at least two OH groups per molecule and the polyisocyanate component comprising a polyisocyanate having at least two isocyanate groups per molecule, wherein at least the phenol resin component contains a solvent, and wherein at least one of the phenol resin component and the polyisocyanate component comprises a solvent selected from the group consisting of alkyl silicates, alkyl silicate oligomers and mixtures thereof.
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