Microelectronic assemblies having solder-wettable pads and conductive elements
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 15, 2002
Issued Date -
N/A
app pub date -
Sep 13, 2001
filing date -
Mar 25, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic assembly includes a component having one or more conductive pads, with each conductive pad having a plurality of solder-wettable strips extending outwardly away from a center, the solder wettable strips being bounded by non solder-wettable material. The microelectronic assembly also includes a composite conductive element positioned atop at least one of the conductive pads, the composite conductive element including a solid conductive core and a layer of solder material overlying the solid conductive core, the solid conductive core having a higher melting temperature than the layer of solder material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully