Wafer type probe card with micro tips for testing integrated circuit chips
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United States of America Patent
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Oct 15, 2002
Grant Date -
N/A
app pub date -
Nov 26, 1996
filing date -
Dec 2, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wafer probe card for a probing test of an integrated circuit chip on a silicon wafer is disclosed. As the wafer probe card is made of a silicon wafer and manufactured by a general wafer fabrication process, the wafer probe card having a desired silicon micro tip has the same physical characteristics as that of the silicon IC chip. Accordingly, when probing test of a semiconductor IC chip by connecting the silicon micro tip to a pad, all the chips on the wafer can be tested at the same time to thereby simplify and automate the process of the probing test.
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