Weather resistant sound attenuating modular communications headset
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United States of America Patent
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-
Oct 15, 2002
Grant Date -
N/A
app pub date -
Sep 21, 1999
filing date -
Sep 21, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A weather resistant sound attenuating communications headset of modular construction includes two ear cup modules, a microphone boom module, a head band module, a headband cable module, and a termination cable module. The modular construction allows easy replacement of modules as well as selected components of the modules under field conditions without the need for tools. Replaceable water resistant thin film membranes are employed to provide weather protection as well as hygienic protection for the microphone, speaker and amplification electronics. The thin film membranes which cover areas which come into intimate contact with the wearer are easily replaceable under field conditions. Thus a headset that is shared by more than one user can be hygienically cleansed by simple replacement of the microphone and ear cup membranes.
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