Importance

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Abstract

A method and apparatus are provided for substrate handling. In a first aspect, a temperature adjustment plate is located below a substrate carriage and is configured such that a substrate may be transferred between the temperature adjustment plate and the substrate carriage by lifting and lowering the substrate carriage above and below the top surface of the temperature adjustment plate. The temperature adjustment plate may be configured to heat and/or cool a substrate positioned thereon. In a second aspect, the substrate carriage is magnetically coupled so as to rotate and/or lift and lower magnetically, thereby reducing particle generation via contact between moving parts (and potential chamber contamination therefrom). In a third aspect, a substrate handler positioned below the substrate carriage is both magnetically coupled and magnetically levitated, providing further particle reduction. The magnetic levitation is preferably achieved via four radially disposed and vertically arranged magnet pairs having distance sensors for maintaining desired spacing therebetween. In a most preferred embodiment, one substrate is heated/degassed on a first portion of a temperature adjustment plate in preparation for processing while a second substrate is processed, and a third processed substrate is cooled on a second portion of the temperature adjustment plate.

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First Claim