Environment exchange control for material on a wafer surface

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United States of America Patent

PATENT NO 6468586
SERIAL NO

09566605

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).

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Patent Owner(s)

  • ASML HOLDING N.V.;ASML US, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Golden, Kevin Wallkill, NY 5 60
Gurer, Emir Scotts Valley, CA 23 305
Lee, Ed C Cupertino, CA 15 163
Lewellen, John W San Jose, CA 16 128
Reynolds, Reese Los Gatos, CA 20 365
Wackerman, Scott C Mountain View, CA 5 58
Zhong, Tom Santa Clara, CA 62 1341

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