Web process interconnect in electronic assemblies
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United States of America Patent
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-
Oct 22, 2002
Grant Date -
May 23, 2002
app pub date -
Mar 16, 1999
filing date -
Mar 16, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.
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