Method to encapsulate bumped integrated circuit to create chip scale package
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United States of America Patent
Stats
-
Oct 22, 2002
Grant Date -
N/A
app pub date -
Jul 19, 2000
filing date -
Jul 19, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An encapsulated bumped die is provided. Singulated bumped dice are attached to a die attach panel. The die attach panel and dice are placed in a mold, where the bumps are partially flattened. A mold compound is then used to encapsulate the dice and panel. The mold compound is cured. The encapsulated dice are then singulated. The encapsulated dice may then be directly mounted on a substrate such as a PC board. The encapsulation provides added protection to the dice.
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