Method of fabricating a BGA package using PCB and tape in a die-up configuration
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United States of America Patent
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Oct 22, 2002
Issued Date -
N/A
app pub date -
Dec 2, 1999
filing date -
Nov 18, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A die-up configuration includes a rigid circuit board with electrically conductive plated-through holes formed therethrough and an integrated-circuit die mounted to the upper surface of which a flexible insulated tape layer is fixed to the upper surface of a rigid circuit board and which has a number of wire-bonding sites. Conductive vias or plated-through holes are provided for connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the contact areas formed on the lower surface of the flexible insulated tape layer. Conductors are provided for connecting respective contact areas on the lower surface of the flexible insulated tape layer to solder balls on the bottom of the rigid circuit board.
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