Styrene resin composition and method of manufacturing the same, and method of manufacturing styrene resin molded products
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United States of America Patent
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Oct 22, 2002
Issued Date -
N/A
app pub date -
Sep 13, 2000
filing date -
Jan 29, 1998
priority date (Note) -
Expired
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Abstract
Disclosed is a resin composition containing the following components (A), and (B) or optionally, (C), (D), and (E): (A) an atactic polystyrene or a mixture of an atactic polystyrene and a rubber-like elastic substance: 30 to 95 parts by weight; (B) a syndiotactic polystyrene having a melting point of not higher than 255.degree. C.: 70 to 5 parts by weight; (C) a polyphenylene ether having an intrinsic viscosity of 0.5 deciliter/g or less as measured in chloroform at 25.degree. C.; (D) an inorganic filler; and (E) a polymer having compatibility or affinity with components (A) and (B) and having a polar group. The styrene resin composition exhibits improved solvent resistance and remarkable impact resistance. The composition of the invention is produced by kneading the components within a resin temperature range between the melting point of component (B) and 270.degree. C. Resin molded products are manufactured through use of the styrene resin composition by adjusting the resin temperature during molding to fall within the range from the melting point of component (B) to 270.degree. C.
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