SEMICONDUCTOR DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 22, 2002
Grant Date -
Nov 14, 2002
app pub date -
Apr 25, 2001
filing date -
Apr 25, 2000
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
To provide a semiconductor device with a three-dimensional mounting module using a flexible circuit substrate which is easy to assemble a three-dimensional structure and is excellent in the workability in repair work (or re-work). [MEANS FOR SOLUTION] A flexible circuit substrate 11 has mounting regions 111, 112 and 113 on which electronic components 121, 122 and 123 are mainly mounted, respectively, and other electronic components 124 and 125 are also mounted. The flexible circuit substrate 11 is structured in such a manner that the mounting regions 111.about.113 are folded on top of the other over the base region 110 in a predetermined order (f1.about.f3). An integrated spacer 13 has thick regions 131 and thin regions 132, and is superposed and affixed to the flexible circuit substrate 11 as indicated by arrows with broken lines, and supports the electronic components 121.about.125 stacked in layers. Fixing bosses 134 and aperture sections 14 to be coupled therewith are provided to facilitate positioning.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully