Conductive interconnect structures and methods for forming conductive interconnect structures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 22, 2002
Grant Date -
N/A
app pub date -
Jan 31, 2000
filing date -
Jan 31, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Interconnect structures and methods for making interconnect structures are disclosed. A typical interconnect structure has a tapered first end portion having a first substantially planar surface and a concave surface adjacent to the first planar surface. A second end portion of the interconnect structure includes a second substantially planar surface. The second planar surface has a larger area than the first planar surface. An intermediate portion is disposed between the first end portion and the second end portion.
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