Resin encapsulated electrode structure of a semiconductor device, mounted semiconductor devices, and semiconductor wafer including multiple electrode structures
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United States of America Patent
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Oct 22, 2002
Grant Date -
Nov 15, 2001
app pub date -
Jul 9, 2001
filing date -
Nov 11, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor integrated circuit device includes a semiconductor substrate having a first surface and including an electrode on the first surface of the semiconductor substrate; a surface protecting film covering the first surface of the semiconductor substrate; an electrode underlayer on the surface protecting film, in electrical contact with the electrode; an external electrode on the surface protecting film, in electrical contact with the electrode underlayer, and having a substantially planar external surface; and a barrier part on the surface protecting a barrier against intrusion of moisture and ions into the semiconductor substrate, the barrier part having the same area as the semiconductor substrate and a substantially planar external surface.
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