Substrate processing apparatus and substrate processing method
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United States of America Patent
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Oct 29, 2002
Issued Date -
N/A
app pub date -
Apr 16, 2002
filing date -
Oct 19, 1999
priority date (Note) -
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Abstract
Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.
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