Method of adhering a wafer to wafer tape
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United States of America Patent
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-
Oct 29, 2002
Issued Date -
N/A
app pub date -
Aug 11, 2000
filing date -
Jun 5, 1997
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and apparatus (10) for securing a fragile wafer (16) to a wafer tape (26) secured taut across a wafer frame (24). A gentle point force (72) is provided by a roller wheel (36) mounted on a rotatable arm (30) to securely adhere the wafer tape (26) to the backside of the wafer (16). Preferably, a spiral pattern (70) is formed by the rotating roller (36) to secure the wafer tape (26) to the wafer (16) to avoid forming air bubbles or creases between the wafer tape and wafer. The method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are to be subsequently broken along kerfs.
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