Method for integrated circuit packaging
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United States of America Patent
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Oct 29, 2002
Grant Date -
Oct 10, 2002
app pub date -
Apr 9, 2001
filing date -
Apr 9, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the microelectronic device package are performed resulting in savings from the removal of more expensive batch processing steps.
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