Semiconductor processing method for processing discrete pieces of substrate to form electronic devices
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United States of America Patent
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Oct 29, 2002
Grant Date -
Dec 27, 2001
app pub date -
Aug 20, 2001
filing date -
Jul 30, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor processing system for the production of semiconductor electronic devices is described, which includes a sequence of semiconductor processing steps carried out on a plurality of semiconductor processing machines, whereby the processing is carried out on discrete pieces of substrate which are smaller than conventional semiconductor wafers but may be made therefrom, or from larger diameter semiconducting wafers or from materials onto which semiconductor layers may be formed, and the discrete substrate pieces are selectably processable into the electronic devices either individually or as a plurality removably fixed to a support.
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