Method of manufacturing electronic component
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United States of America Patent
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Nov 5, 2002
Grant Date -
N/A
app pub date -
Dec 21, 1998
filing date -
May 7, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A manufacturing method for multi-layered electronic parts which is characterized in that from a roll of a polyethylene microporous sheet which has an electrode layer forming agent formed on its surface, contains 45 to 80 volume percent of inorganic filler, and has a thickness of 25 .mu.m or less, tensile strengths of 3 kg/mm.sup.2 or more in the longitudinal direction and of 1 kg/mm.sup.2 or more in the transverse direction, and an elongation of 30% or less in the MD direction, layered electronic parts are formed via (a) a step of unwinding the sheet, (b) a step of cutting the sheet in a predetermined length, (c) a step of stacking the cut sheets, and (d) a step of cutting the layered structure and efficient production is made possible.
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